iosr-JEEE   Volume-16 ~ Issue-3 ~ May – June 2021

Abstract: When the wind power is connected to an electric grid affects the power quality. The effects of the power quality measurements are-the active power, reactive power, variation of voltage, flicker, harmonics, and electrical behavior of switching operations. The installation of wind turbine with the grid causes power quality problems are determined by studying this paper. For this Static Compensator (Statcom) with a Battery energy storage system (BESS) at the point of common coupling to mitigate the power quality problems. The grid connected wind energy generation system for power quality improvement by using Statcom - control scheme is simulated using Matlab/Simulink in power system block set. This......

Keywords: IEC-61400-21, power quality, wind power, Statcom

[1]. Sannino, "Global power systems for sustainable development," in IEEE General Meeting, Denver, CO, Jun. 2004.
[2]. K. S. Hook, Y. Liu, and S. Atcitty, "Mitigation of the wind generation integration related power quality issues by energy storage," EPQU J., vol. XII, no. 2, 2006.
[3]. R. Billinton and Y. Gao, "Energy conversion system models for adequacy assessment of generating systems incorporating wind energy," IEEE Trans. on E. Conv., vol. 23, no. 1, pp. 163–169, 2008, Multistate.
[4]. Wind Turbine Generating System - Part 21, International standard-IEC61400-21, 2001.
[5]. J. Manel, "Power electronic system for grid integration of renewable energy source: A survey," IEEE Trans. Ind. Electron. , vol. 53, no. 4, pp. 1002–1014, 2006, Carrasco..

Abstract: In this paper the Facial Emotion Identification (FEI) System that defines the different aspects of the human behavior and also the mental frame of mind. The MATLAB - Arduino based Communication Technique is used to accumulate, observe and examine the human facial emotions in immediate physical surrounding environment. FEI system can recognize expressions from a person's face. It helps in several platforms like health care, advertising, criminal identification, access and security payment data and social robotic interaction. The facial Emotion Identification system algorithm is developed on MATLAB. The proposed technique can detect facial emotion and track it by using MATLAB - Arduino communication. There are various methods of FEI exist. Face detection algorithm on MATLAB platform proposed by Viola and Jones algorithms with LBP and SVMs for training sample.....

Keywords: Facial Emotion Identification (FEI), image tracking, Local Binary Pattern (LBP), Support Vector Machines (SVMs) Arduino, MATLAB

[1]. P.Viola and M.Jones," Rapid Object Detection using a Boosted Cascade of Simple Features",conf. on comp. vision and pattern recognition 2001.
[2]. Nandita and Aggarwal,". Robust Face Detection and Tracking Using Pyramidal Lucas Kanade Tracker Algorithm",IJCTA, vol.2
[3]. G M R and Rajesham J 2013 International Journal of Scientific & Engineering Research 4 1540–1546
[4]. C. Wren, A. Azarbayejani, T. Darrell, and A. Pentland,"Finder: Real-time tracking of the human body", IEEE Trans. Pattern Analysis and Machine
[5]. Anil, J. and L.P. Suresh. Literature survey on face and face expression recognition. in 2016 International Conference on Circuit, Power and Computing Technologies (ICCPCT). 2016. IEEE..

Abstract: In now-a-days trend of wearable antenna, Monopole antenna are good choice because of its simple structure, omnidirectional radiation pattern and ease of fabrication. The antenna#1 is designed using Polyamide substrate with thickness of 0.8mm having dielectric constant of 4.3 and dimension of 30mm X 20mm and antenna#2 is designed using Teslin substrate with thickness of 0.712mm having dielectric constant of 2.18 and dimension of 30mm X 20mm.Antenna designed have ultra-wideband of 12.4 GHz and 14.2 GHz. The antenna#1 operates over frequency range of 2 GHz to 14.4 GHz having bandwidth of 12.4 GHz and antenna#2 operates over frequency range of 2 GHz to 16.2 GHz having bandwidth of 14.2 GHz. The antenna designed are intended for ultra-wideband and Body Centric wearable Communication.....

Keywords: Polyamide, Teslin, Rectangular Microstrip, Ultra-wide band.

[1]. K. S. Chakradhar, Inumula Veeraraghava Rao, DT. Durga Prasad, P. Raju, V. Malleswara Rao Wearable Textile Patch Antenna for Medical Applications. International Journal of Innovative Technology and Exploring Engineering (IJITEE) ISSN: 2278-3075, Volume-9 Issue-2S3, December 2019.
[2]. Tarannum U. Pathan, Rajneesh K. Karn Research of Wearable Textile Antennas for WBAN Applications. International Journal of Engineering and Advanced Technology (IJEAT) ISSN: 2249 – 8958, Volume-8, Issue-6S3, September 2019.
[3]. Shenbaga k, Takshala Devapriya A Wearable Antenna for Medical Application. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056, p-ISSN: 2395-0072 Volume-06 Issue-04 | Apr 2019.
[4]. Shorav Khan, Vinod Kumar singh, Naresh.B Textile Antenna Using Jeans Substrate for Wireless Communication Application. International Journal of Engineering Technology Science and Research, (IJETSR) ISSN: 2394 – 3386, Volume-2, Issue-11, November 2015.
[5]. Neha Gupta, Vinod Kumar Singh, Zakir Ali, J. Ahirwar Stacked Textile Antenna for Multi Band Application Using Foam Substrate. International Conference on Computational Modeling and Security (CMS 2016).

Abstract: Background: The modeling of Controlled Collapse Chips Connections (C4) and other large arrays of parallel components using finite element analysis can be a time consuming process. Simplified models such as flux tube modeling replace the solder joints and the underfill with an equivalent homogeneous layer representing the whole layer. This flux tube model uses a single parameter to represent the heat flux constriction at the entrance and exit areas of solder joints, to calculate the conductivity of the equivalent layer (solder joint and underfill). Materials and Methods: We show that the validity of existing parameterizations for the flux constriction is limited to a few simple geometries like the one of a tube. We further present a study of several tridimensionnal geometrical and material parameters that have.....

Keywords: Thermal management of electronics, Modeling, Mathematical model

[1]. H. Clauberg, A. Rezvani, E. Galipeau, M. Wasserman, T. Colosimo, G. Frick, D. Buergi and B. Chylak, "Advanced Thermocompression Flip Chip Bonding", 2014 IEEE 16th Eectronics Packaging Technology Conference (EPTC), 2014, pp. 492-495
[2]. K.A. De Las Alas, C. Ison, J.O. Rivera, R. De La Cruz, R. Aguares, D. Vyas, T. Nguyen, M. Bailon-Sominac, "Temperature and Humidity Stress Failure on Copper Pillar (CuP) Flip Chip Package Device", 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 1-4 Jul, 2017
[3]. V. Smet, T-C. Huang B. Singh, V. Sundaram, P. M. Raj, R. Tummala, "Interconnection Materials, Process and Tools for Fine-pitch Panel Assembly of Ultra-thin Glass Substrates", IEEE Electronic Components and Technology Conference, 2015, pp. 475-483
[4]. H.Y. Yang, D. Pinjala, Y.K. Joshi, T.N. Wong, K.C. Toh, "Thermal Modelinf and Design of Liquid Cooled Heat Sink Assembled with Flip-Chip Ball Array Packages", 53rd Electric Components and Technology Conference, 2003
[5]. M. M. Yovanovich, V. W. Antonetti, "Application of thermal contact resistance theory to electronic packages", chapter 2 in 'Advances in thermal modeling of electronic components and systems', vol. 1, A. Bar-Cohen and A. D. Kraus, eds, New York : Hemisphere Publishing Corporation, 1988

Abstract: Evolving from the era of British Standards Specifications to multiplicity of standards, Electricity Industry in Nigeria has witnessed very negative transformations. Efforts of engineers to address the matter over the years has not yielded any dividend because control of equipment specifications for the electricity industry is beyond the control of the engineering community. In this write-up, we have tried as much as possible to take an in-dept look at Transformer Vector Group abuse in Nigeria and its attendant consequences on the entire Power System. Efforts have also been made to address multiple cases of transformers introduced into the system with a view to correct the power system anomalies......

KeyWords: Vector Group, Phase Shift, Dy1, Dy5, Dy11, Yyn, Power Transformer, Distribution Transformer

[1]. Z. Gajić*, 2013, "Fault Current Distribution Across Special Transformers" ABB SA Products Sweden, CIGRE, Study Committee B5 Colloquium August 25-31, 2013 Belo Horizonte, Brazil.
[2]. Z. Gajić, 2007, "Differential Protection for Special Industrial Transformers" IEEE Transactions on Power Delivery, Volume 22, Issue 4, October 2007.
[3]. M M V Ravindra, Technical Presentation on Vector Group, https://dokumen.tips/embed/v1/transformer-vector-group-563104fa313e3.html
[4]. Eric Christensen, 10 April 2014, "CT Phase Shift and its Affect on Power Factor" Magnelab, Inc..
[5]. Zoran Gajic, May 2008, "Differential Protection for Arbitrary Three-Phase Power Transformers" ABB Grid Automation Products, Researchgate, https://www.researchgate. net/publication/299748214

Abstract: Ordinary single-phase or three phase two-level inverter gives a square wave output which when applied to electrical device may change its properties as the inverter output waveform is not sinusoidal rather contains lower and higher order harmonics in addition to fundamental. Moreover, the output voltage cannot be controlled. Although the output voltage waveform of these inverters can be improved by selecting specific switching angles of power semiconductor devices using SHEPWM technique for elimination of lower order harmonics with some obvious limitations. On the other hand, for a multilevel inverter, output voltage waveform can be synthesized in an easier way with systematic switching of semiconductor devices to achieve better performances than a two-level.....

Keywords: Harmonic Factor (HF), inverter, power semiconductor devices, SHE-PWM technique, simulation, total harmonic distortion (THD), transcendental equation

[1]. XU L., AGELIDIS V.G.: 'VSC transmission system using flying capacitor multilevel converters and hybrid PWM control', IEEE Trans. Power Deliv., 2007, 22, (1), pp. 693 – 702
[2]. G. Ghosh et. el. "A Comparative study of different multilevel inverters", 20171st International Conference on Electronics, Materials Engineering and Nano-Technology (IEMENTech). ISBN 978-1-5386-1703-8.
[3]. Muhammad H. Rashid, "Power Electronics".
[4]. Daniel W. Hart, "Power Electronics".
[5]. Gautam Ghosh, P K Sinha Roy, Rajiv Ganguly. "Selective Harmonic Elimination in a Conventional Single Phase Full-Bridge Inverter with Adjustable Output", IOSR Journal of Electrical and Electronics Engineering (IOSR-JEEE) e-ISSN: 2278-1676,p-ISSN: 2320-3331, Volume 13, Issue 4 Ver. II (Jul. – Aug. 2018), PP 51-57

Abstract: This article briefly reviews the oxidation and annealing effects on the flatband voltage of the SiC MOS device and the surface field-effect mobility of the MOSFET device. The oxide charge densities are calculated from the flatband voltages observed after processing in a MOS device. The oxide charges are found to be mainly at the SiO2/SiC interface in the form of near-interface trap charges. NO annealing has been found to shift the flatband voltage in the p-type MOS device when Nitrogen gets incorporated only at the interface, but not in the n-type device, with both the samples having wet re-oxidised oxide. This however, does not change the slope of the Fowler-Nordheim plot in the MOS device as if only the metal-semiconductor work function difference has changed, and yields the same hole effective mass for the bulk oxide of 0.58m, with and without N at the interface. The MOS device on SiC is shown to contain near-interface traps in the oxide near the SiC conduction band associated with an E'centre that limits the channel mobility of the power MOSFET.....

Keywords: Oxidation, Annealing, Metal-Oxide-Semiconductor, Silicon Carbide

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